Capturing of Die wafer Quantity IN SAP WM
I have a customer requirement where the wafer is recieved in wafer Box.The box contains individual wafers with BUOM quantities inside.
Full Box contains 10000 PC, if it contains 4 wafers inside then wafer Quantities are 3000PC,2000PC,5000PC.
We need to capture bothe quantities while recieving and stored in the warehouse.the issuing from the warehouse for production order staging wil
l be done in the total wafer Box Quantity(10000PC) as well as individual wafer Quantity (eg: 300 PC).
Could you please let me know how can we capture the requirement in SAP through out the cycle.